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将校园卡复制到小米手环
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使用ESP8266完成校园网WEB认证
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windows11系统自带VPN连接不上群辉VPN服务器问题
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Verilog中为inout类型赋值
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数字振镜XY2-100协议
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2023-06-27
zynq 程序固化过程中不切换启动模式,强制烧写
问题:在利用vivado sdk烧录QSPI flash过程中,提示要切换至jtag模式,由于模式切换电阻不知位于何处,于是寻找一种软件调整来达到强制烧写的母的。最终办法: 也就是说通过在“指定的fsbl”中的main.c中如下位置添加如下语句,防止FSBL在编程运行时从Flash设备加载任何现有分区。/* * Read bootmode register */ BootModeRegister = Xil_In32(BOOT_MODE_REG); BootModeRegister &= BOOT_MODES_MASK; //add this line to trick boot mode to JTAG BootModeRegister = JTAG_MODE;
2023年06月27日
5 阅读
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2023-06-08
常见激光器控制协议
Fiber激光器转接板输出接口说明如下表,通过EXIO_DIR设置好IO方向后,便可通过右侧的IO编号控制激光器。D0和D7一共8位组合设置激光器的功率,激光出光口为OUT8,激光出光前先设置好激光器的功率并打开激光使能开关OUT47,红光的开关为OUT48。→EXIO扩展IO配置说明:采用EXIO接口扩展后, 均需要使用EXIO_DIR指令对扩展IO进行方向配置才可正常使用。按上节接线完成后,配置好EXIO扩展IO接口的IO方向之后才能控制激光器,扩展IO功能设置EXIO_DIR(0, $8FFFF)。指令语法:EXIO_DIR(isel, dirbit)Isel:0(指定激光器类型)dirbit: 按位设置是否输出, 0- 输入, 1-输出 (自定义配置转接口对应的信号类型)控制器与激光器的接线参考图如下:3.激光控制说明例如某激光器的控制端口针脚说明如下表,对比上表可知,Fiber-DB25头转接板输出接口采用与该激光器匹配的标准端口,针脚定义一致,可直接与该激光器相连,再通过OUT引脚控制激光器。主要控制端子说明:功率信号定义:设置针 1~8 的 TTL 信号,通过 TTL 信号的组合来设置泵浦激光二极管的电流,从而控制激光器的输出功率。通过 1~8 针可以设置 0~255 范围内的编码,对应于 0~100%的功率输出。电源:针17和GND组成激光器控制端口的供电回路,采用5V直流供电。4.打标应用例程编程界面如下图,采用Basic和HMI混合编程,Basic完成控制过程,HMI编写界面。初始化定义相关变量,初始化轴参数,配置好FIBER转接板的方向为输出,后续的激光加工控制由HMI界面的按钮触发。D0和D7一共8位组合设置激光器的功率,通过AOUT3配置激光功率;激光出光口为OUT8,激光出光前先设置好激光器的功率并打开激光使能开关OUT47,红光的开关为OUT48。(1)Basic程序如下'**********************************************************HMI初始化Global Sub Sub_HmiInit()Sub_VarDefine() '定义变量Sub_AxisInit() '初始轴参数Sub_SetExioFiber 'Fiber转化板参数设置End Sub'**********************************************************HMI刷新扫描Global Sub Sub_HmiScan()End Sub'**********************************************************变量定义初始化Global Sub Sub_VarDefine()Global Const Gc_AxisX = 4Global Const Gc_AxisY = 5Global Const Gc_Out_Laser = 8 '出光OUT口Global Const Gc_Out_LaserEnable = 47 '激光使能Global Const Gc_Out_Red = 48 '红灯Global Const Gc_Aout_Laser = 3 '激光能量模拟量输出口Global Gv_StartDelay '开光延时usGv_StartDelay = 1000Global Gv_LastDelay '关光延时usGv_LastDelay = 1000Global Gv_CorDelay '拐角延时usGv_CorDelay = 1000Global Gv_JumpDelay '跳转延时usGv_JumpDelay = 1000Global Gv_LaserPower '激光功率0-2^8Gv_LaserPower = 128Global Gv_EmpSp '空移速度Gv_EmpSp = 10000Global Gv_WorkSp '加工速度Gv_WorkSp = 5000Global Gv_WorkMode '加工模式 0-红光 1-激光Gv_WorkMode = 0Global Gv_MarkSize '标刻大小Gv_MarkSize = 80End Sub'**********************************************************轴参数初始化Global Sub Sub_AxisInit()base(Gc_AxisX,Gc_AxisY)Atype = 21,21 '轴类型 振镜轴Units = 500,500 '脉冲当量speed = 100,100 '运动速度Accel = 10000,10000 '加速度AXIS_ZSET = 3,3 '开启精准输出End Sub'**********************************************************切换红光Global Sub Sub_Btn_Red()if op(Gc_Out_Red) THENop(Gc_Out_Red,OFF)ELSEop(Gc_Out_Red,ON)endifEnd Sub'**********************************************************切换出光Global Sub Sub_Btn_Laser()if op(Gc_Out_Laser) THENAout(Gc_Aout_Laser) = 0op(Gc_Out_Laser,OFF)DELAY(100)op(Gc_Out_LaserEnable,OFF)ELSEAout(Gc_Aout_Laser) = Gv_LaserPower '设置能量op(Gc_Out_LaserEnable,ON) '打开激光使能DELAY(100)op(Gc_Out_Laser,ON) '出光endifEnd Sub'**********************************************************fiber转换板处理GLOBAL SUB Sub_SetExioFiber()'修改扩展接口方向为输出EXIO_DIR(0, $FFFFF)END SUB'**********************************************************空移到起点Global Sub Sub_MoveEmp(StartX,StartY)base(Gc_AxisX,Gc_AxisY)FORCE_SPEED = Gv_EmpSpMOVESCANABS(StartX,StartY) '空移到起点MOVE_DELAY(Gv_JumpDelay/1000) '跳转延时if Gv_WorkMode =1 thenMOVE_OP(Gc_Out_Laser, ON)ELSEMOVE_OP(Gc_Out_Red, ON)endifMOVE_DELAY(Gv_StartDelay/1000) '开光延时End Sub'**********************************************************直线运动'XPos 运行结束点X坐标'YPos 运行结束点Y坐标'If_End 是否最后的结束点,是启动关光参数Global Sub Sub_MoveLine(XPos,YPos,If_End)FORCE_SPEED = Gv_WorkSpMOVESCANABS(XPos,YPos) '运动到加工点if(If_End) thenMOVE_DELAY(Gv_LastDelay/1000) '关光延时if Gv_WorkMode =1 thenMOVE_OP(Gc_Out_Laser, OFF)ELSEMOVE_OP(Gc_Out_Red, OFF)endifendifEnd Sub'**********************************************************画矩形运动'XPos 运行结束点X坐标'YPos 运行结束点Y坐标'If_End 是否最后的结束点,是启动关光参数Global Sub Sub_MoveRect(StartX, StartY, EndX,EndY,If_End)FORCE_SPEED = Gv_WorkSpMOVESCANABS(StartX,EndY)MOVE_DELAY(Gv_CorDelay/1000)MOVESCANABS(EndX, EndY)MOVE_DELAY(Gv_CorDelay/1000)MOVESCANABS(EndX, StartX)MOVE_DELAY(Gv_CorDelay/1000)MOVESCANABS(StartX, StartY)if(If_End) thenMOVE_DELAY(Gv_LastDelay/1000) '关光延时if Gv_WorkMode =1 thenMOVE_OP(Gc_Out_Laser, OFF)ELSEMOVE_OP(Gc_Out_Red, OFF)endifendifEnd Sub'**********************************************************Global Sub Sub_Move9Point()Local dScanSizedScanSize = Gv_MarkSizeMOVE_Aout(Gc_Aout_Laser,Gv_LaserPower) '设置能量MOVE_op(Gc_Out_LaserEnable,ON) '打开激光使能MOVE_DELAY(10)TRIGGER'绘制横线Sub_MoveEmp((-dScanSize/2 - dScanSize/10), 0)Sub_MoveLine((dScanSize/2 + dScanSize/10), 0,TRUE)'绘制竖线Sub_MoveEmp(0, (-dScanSize/2 - dScanSize/10))Sub_MoveLine(0,(dScanSize/2 + dScanSize/10),TRUE)'矩形Sub_MoveEmp(-dScanSize/2, -dScanSize/2)Sub_MoveRect(-dScanSize/2, -dScanSize/2, dScanSize/2, dScanSize/2,TRUE)'绘制XSub_MoveEmp((dScanSize/2-0.06*dScanSize), -0.02*dScanSize)Sub_MoveLine((dScanSize/2-0.02*dScanSize), -0.08*dScanSize,TRUE)Sub_MoveEmp((dScanSize/2-0.02*dScanSize), -0.02*dScanSize)Sub_MoveLine((dScanSize/2-0.06*dScanSize), -0.08*dScanSize,TRUE)'绘制YSub_MoveEmp(0.02*dScanSize, (dScanSize/2-0.02*dScanSize))Sub_MoveLine(0.04*dScanSize, (dScanSize/2-0.05*dScanSize),TRUE)Sub_MoveEmp(0.06*dScanSize, (dScanSize/2-0.02*dScanSize))Sub_MoveLine(0.04*dScanSize, (dScanSize/2-0.05*dScanSize),FALSE)Sub_MoveLine(0.04*dScanSize, (dScanSize/2-0.08*dScanSize),TRUE)'回原点FORCE_SPEED = Gv_EmpSpMOVESCANABS(0,0) '空移到原点MOVE_Aout(Gc_Aout_Laser,0) '关闭能量MOVE_op(Gc_Out_LaserEnable,OFF) '关闭激光使能End Sub'**********************************************************Global Sub Sub_Bnt_TaskRun() '九点标定按钮STOPTASK 1RUNTASK 1,Sub_Move9PointEnd Sub'**********************************************************Global Sub Sub_Btn_TaskStop() '停止按钮STOPTASK 1base(Gc_AxisX,Gc_AxisY)Cancel(2)End Sub
2023年06月08日
5 阅读
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2023-06-07
MDK和各种pack软件包镜像下载
MDK软件:mdk454.exe (491.23MB)mdk474.exe (576.82MB)MDK527.EXE (802.01MB)MDK529.EXE (835.12MB)MDK 530.EXE (875.73MB)MDK531.EXE (875.96MB)MDK532.EXE (892.75MB)MDK533.EXE (923.68MB)MDK534.EXE (942.70MB)MDK535.EXE (890.96MB)MDK536.EXE (891.11MB)MDK537.EXE (855.73MB)最后一个AC5编译器,从MDK5.37开始,不再默认安装,需要独立安装ARMCompiler_506_Windows_x86_b960.zip (80.94MB)MDK兼容包:(MDK4升级到MDK5的兼容包,截止到MDK5.25已经没有再更新了)可用于Arm7, Arm9,Cortex-RMDK79525.EXE (127.34MB)可用于Cortex-MMDKCM 525.EXE (359.98MB)TensorFlow和神经网络内核Ethos-U:ARM.ethos-u-core-driver.0.4.0.pack (80.06KB)tensorflow.gemmlowp.0.4.0.pack (881.69KB)tensorflow.tensorflow-lite-micro.0.4.0.pack (597.45KB)tensorflow.kissfft.0.4.0.pack (65.07KB)tensorflow.ruy.0.4.0.pack (351.56KB)Cyclone TCP:Oryx-Embedded.Middleware.1.9.8.pack (13.67MB)Oryx-Embedded.Middleware.2.0.0.pack (13.86MB)Oryx-Embedded.Middleware.2.0.2.pack (14.40MB)Oryx-Embedded.Middleware.2.0.4.pack (15.61MB)Oryx-Embedded.Middleware.2.1.2.pack (16.32MB)wolfSSL和wolfCrypt加密库I-CUBE-WOLFSSL-WOLFSSL.pack (11.85 MB)wolfSSL.wolfSSL.4.6.0.pack (15.79MB)CMSIS:ARM.CMSIS.5.6.0.pack (100.66MB)ARM.CMSIS.5.7.0.pack (110.86MB)ARM.CMSIS.5.8.0.pack (34.49MB)ARM.CMSIS.5.9.0.pack (32.55MB)ARM.CMSIS-Driver_Validation.2.0.0.pack (8.32MB)ARM.CMSIS-RTOS_Validation.1.1.0.pack (511.87KB)ARM.CMSIS-Driver.2.6.1.pack (576.73KB)ARM.CMSIS-Driver.2.7.0.pack (592.16KB)MDK中间件(2022-04-28):Keil.MDK-Middleware.7.10.0.pack (123.50MB)Keil.MDK-Middleware.7.11.0.pack (108.24MB)Keil.MDK-Middleware.7.11.1.pack (108.25MB)Keil.MDK-Middleware.7.12.0.pack (108.30MB)Keil.MDK-Middleware.7.13.0.pack (174.86MB)Keil.MDK-Middleware.7.14.0.pack (28.94MB)Keil.MDK-Middleware.7.15.0.pack (30.10MB)LwIP(2020-07-16):lwIP.lwIP.2.1.2.pack (5.12MB)MbedTLS(2022-02-17)ARM.mbedTLS.1.6.1.pack (4.92MB)ARM.mbedTLS.1.7.0.pack (16.24MB)ARM.mbedTLS.1.8.0.pack (20.08MB)Mbed Crypto(2020-06-07)ARM.mbedCrypto.3.0.1.pack (3.19MB)ARM Compiler扩展包:Keil.ARM_Compiler.1.6.3.pack (3.88MB)Keil.ARM_Compiler.1.7.0.pack (3.88MB)安全固件TF-M:ARM.TFM.2.1.0.pack (61.82MB)ARM.TFM-Test.1.0.0.pack (197.90KB)Keil.LPC55S6x_TFM-PF.1.0.0.pack (2.97MB)Keil.STM32L5xx_TFM-PF.1.0.0.pack (2.22MB)ST所有产品线:Keil.STBlueNRG-1_DFP.1.2.0.pack (1.45MB)Keil.STBlueNRG-2_DFP.1.0.1.pack (3.95MB)Keil.STM32F0xx_DFP.2.1.0.pack (65.20MB)Keil.STM32F1xx_DFP.2.3.0.pack (47.84MB)Keil.STM32F2xx_DFP.2.9.0.pack (66.39MB)Keil.STM32F2xx_DFP.2.10.0.pack (49.96MB)Keil.STM32F3xx_DFP.2.2.0.pack (90.31MB)Keil.STM32F4xx_DFP.2.15.0.pack (248.76MB)Keil.STM32F4xx_DFP.2.16.0.pack (152.53MB)Keil.STM32F7xx_DFP.2.14.0.pack (218.25MB)Keil.STM32H7xx_DFP.2.6.0.pack (339.13MB)Keil.STM32H7xx_DFP.2.7.0.pack (337.51MB)Keil.STM32H7xx_DFP.2.8.0.pack (278.49MB)Keil.STM32H7xx_DFP.3.0.0.pack (278.73MB)Keil.STM32L0xx_DFP.2.1.0.pack (56.13MB)Keil.STM32L0xx_DFP.2.2.0.pack (59.42MB)Keil.STM32L1xx_DFP.1.3.0.pack (39.86MB)Keil.STM32L4xx_DFP.2.6.1.pack (241.56MB)Keil.STM32L5xx_DFP.1.3.0.pack (40.92MB)Keil.STM32L5xx_DFP.1.4.0.pack (44.88MB)Keil.STM32W1xx_DFP.1.0.0.pack (4.09MB)Keil.STM32WBxx_DFP.1.1.0.pack (31.11MB)Keil.STM32WLxx_DFP.1.1.0.pack (28.96MB)Keil.STM32G0xx_DFP.1.3.0.pack (47.37MB)Keil.STM32G4xx_DFP.1.4.0.pack (93.96MB)Keil.STM32MP1xx_DFP.1.3.0.pack (35.02MB)Keil.STM32L562E-DK_BSP.1.0.0.pack (44.69MB)Keil.NUCLEO-L552ZE-Q_BSP.1.0.0.pack (21.38MB)Keil.STM32NUCLEO_BSP.1.7.0.pack (10.22MB)Keil.STM32U5xx_DFP.1.1.0.pack (89.80MB)MDK物联网(2020-05-21):MDK-Packs.AWS_IoT_Device.2.0.0-beta.pack (1.43MB)MDK-Packs.Azure_IoT.1.0.2.pack (3.60MB)MDK-Packs.cJSON.1.0.0.pack (435.31KB)MDK-Packs.Google_IoT_Device.1.0.2.pack (91.03KB)MDK-Packs.HTTP_Parser.1.0.0.pack (113.62KB)MDK-Packs.Jsmn.1.1.0.pack (16.64KB)MDK-Packs.Paho_MQTT.1.0.2.pack (966.52KB)MDK-Packs.QCA400x_Host_Driver_SDK.1.1.0.pack (458.59KB)MDK-Packs.QCA400x_WiFi_Driver.1.1.0.pack (21.92KB)MDK-Packs.TinyCBOR.1.0.0.pack (113.91KB)2020-07-16MDK-Packs.IoT_Socket.1.2.1.pack (180.35KB)MDK-Packs.Watson_IoT_Device.1.0.2.pack (208.74KB)RT-Thread:RealThread.RT-Thread.3.1.3.pack (2.06MB)FreeRTOS软件包ARM.CMSIS-FreeRTOS.10.3.1.pack (53.10MB)LVGLLVGL.lvgl.1.0.1-alpha3.pack (4.62MB)emWin6.xKeil.MDK-Middleware_Graphics.1.0.0.pack (197.83MB)对应emWin6.24:Keil.MDK-Middleware_Graphics.1.1.0.pack (122.92MB)TouchGFXSTMicroelectronics.X-CUBE-TOUCHGFX.4.18.1.pack (487.12MB)
2023年06月07日
11 阅读
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